Webdepends on the F density in the plasma and the effects of ion bombardment. The process conditions for a high etch selectivity are a 0.3 to 0.5 CF4 flow ratio and a –600 V to –650 V DC bias voltage according to the process pressure in our experiment. Etching uniformity was improved with an increase in the CF4 flow ratio in the gas mixture, an WebAug 15, 2011 · Contour plot of Si etch rates (nm/min) as a function of source power and bias power. CHF 3 (40 sccm)/Ar (10 sccm) plasma is used at 10 mTorr. The distance of samples from plasma source was 4 cm. In this work, we apply density functional theory (DFT) to …
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WebCHF 3 is used in the semiconductor industry in plasma etching of silicon oxide and silicon nitride. Known as R-23 or HFC-23, it was also a useful refrigerant, sometimes as a replacement for chlorotrifluoromethane (CFC-13) and is a byproduct of its manufacture. When used as a fire suppressant, the fluoroform carries the DuPont trade name, FE-13. facial north park
SiO2/Si selectivity in high density CHF3/CH4 plasmas: Role of …
WebCHF3 is listed in the World's largest and most authoritative dictionary database of abbreviations and acronyms CHF3 - What does CHF3 stand for? The Free Dictionary WebThe need for atomic layer etching (ALE) is steadily increasing as smaller critical dimensions and pitches are required in device patterning. A flux-control based cyclic Ar/C4F8 ALE based on steady-state Ar plasma in conjunction with periodic, precise C4F8 injection and synchronized plasma-based low energy Ar+ ion bombardment has been established for … WebAug 15, 2011 · A model of CF 3 etching Si (2 × 4) surface has been developed based on density functional theory. We find that the reconstruction Si surface tends to be fully F … does talking make a sore throat worse